Xiaomi Redmi Pro: 10-Core Helio X25 confirmed by CEO, brushed metal body teased

Xiaomi already teased 10-Core SoC, dual cameras and OLED display for the Redmi Pro. Today the company's co-founder and CEO Lei Jun confirmed that the smartphone will be powered by Deca-Core MediaTek Helio X25 SoC. The processor was introduced along with the Meizu PRO 6 smartphone back in April. He also said that Redmi Pro will be the flagship smartphone for Redmi series.

As it had promised, Xiaomi also released the third teaser featuring actor Liu Haoran that hints at the brushed metal for the Redmi Pro, as rumored earlier.

Xiaomi Redmi Pro rumored specifications

5.5-inch Full HD (1920 x 1080) OLED display from AUO

Deca-Core MediaTek Helio X25 processor (Cortex 1.4GHz x4 + Cortex A53 2.0GHz x4 + the Cortex A72 2.5GHz X2) with Mali-T880 MP4 GPU

4GB / 6GB RAM, 64GB / 128GB of internal storage

Android 6.0 Marshmallow with MIUI 8

Dual SIM

Fingerprint sensor

12 MP dual rear cameras with Sony IMX260 and ISOCELL S5K2L1 sensors

4G VoLTE, Wi-Fi 802.11 ac/b/g/n (2.4 / 5GHz), Bluetooth 4.1, GPS + GLONASS

3,700mAh battery

The Xiaomi Redmi Pro will be announced in China on July 27th.

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Source: Xiaomi Redmi Pro: 10-Core Helio X25 confirmed by CEO, brushed metal body teased